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Journal of Alloys and Compounds

Volumn 439, Issue 1-2, 2007, Pages 74-80

Effect of surfactant on electrodeposited Ni-P layer as an under bump metallization

(2) Lin, Yung Chi a Duh, Jenq Gong a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Intermetallics; Surfaces and interfaces

Indexed keywords

ELECTROPLATED PRODUCTS; METALLIZING; MICROELECTRONICS; NICKEL ALLOYS; SURFACE ACTIVE AGENTS; SURFACE MORPHOLOGY;

MICROELECTRONIC INDUSTRY; SODIUM DODECYLSULFATE (SDS); SOLDER PASTES; UNDER BUMP METALLIZATION (UBM);

INTERMETALLICS;

EID: 34248570801 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2006.08.067 Document Type: Article

Times cited : (31)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.