Investigating thin film stresses in stacked silicon dioxide/silicon nitride structures and quantifying their effects on frequency response

Journal of Micromechanics and Microengineering

Volumn 17, Issue 5, 2007, Pages 1042-1051

  Zohni, Omar ^a   Buckner, Gregory ^a   Kim, Taeyun ^a   Kingon, Angus ^a   Maranchi, Jeff ^b   Siergiej, Richard ^b  

^a North Carolina State University   (United States)

^b BECHTEL BETTIS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; FREQUENCY RESPONSE; LOW PRESSURE CHEMICAL VAPOR DEPOSITION; MICROELECTROMECHANICAL DEVICES; OXIDATION; SILICON NITRIDE; SILICON WAFERS; STRESSES; THIN FILMS;

FREQUENCY SHIFT; THERMAL OXIDATION; THIN FILM STRESSES;

SILICA;

EID: 34247517313     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/5/026     Document Type: Article

References (28)

1. US Dept. of Defense 1995 Microelectromechanical systems-A DoD dual use technology industrial assessment US Dept. of Defense Final Report
2. Sze S M 1994 Semiconductor Sensors (New York: Wiley)
3. Abothu I, Liu S F, Komarneni S and Li Q H 1999 Mater. Res. Bull. 34 1411-9
4. Masuda T, Miyaguchi Y, Tanimura M, Nishioka Y, Suu K and Tani N 2001 Appl. Surf. Sci. 169 539-43
5. Dey S K and Zuleeg R 1990 Ferroelectrics 112 309-19
6. Chen C and Ryder D 1989 J. Am. Ceram. Soc. 72 1495-502
7. Chapin L N and Myers S A 1990 Mater. Res. Soc. Symp. Proc. 20 153-8
8. Bernstein J et al 1996 Proc 10th IEEE Int. Symp. Applications of Ferroelectrics
9. Polla D L and Francis L F 1996 MRS Bull. 25 59-65
10. Sayer M, Barrow D, Zou L and Amm D T 1992 Ferroelectr. Thin Films: II 243 34
11. Lee C 1996 IEEE Trans Ultrason. Ferroelectr. Freq. Control 43l 553-9
12. Polla D L 1995 Microelectron. Eng. 29 9-17
13. Yi G and Sayer M 1991 Ceram. Bull. 70 1173-9
14. Aegerter M A 1992 J. Non-Cryst. Solids 151 195-202
15. Al-Shareef H N, Kingon A I, Chen X, Ballur K R and Auciello O 1994 J. Mater. Res. 9 2968-75
16. Chen M S, Wu J M and Wu T B 1995 Japan. J. Appl. Phys. 34 4870-5
17. Muralt P, Kohli M, Maeder T, Khonklin A, Brooks K, Luthier R and Setter N 1995 Sensors Actuators A 48 157-65
18. Muralt P 1999 J. Electroceramics 3 2
19. Madou M J 2002 Fundamentals of Microfabrication (The Science of Miniaturization) 2nd edn (Boca Raton, FL: CRC Press)
20. Yi T and Kim C-J 1999 Meas. Sci. Technol. 10 706-16
21. Lin L, Pisano A and Howe R T 1997 IEEE J. Microelectromech. Syst. 6 313-21
22. Zhang T Y, Chen L Q and Fu R 1999 Acta Mater. 47 3869-78
23. Lu J 1996 Handbook of Measurement of Residual Stresses 1st edn (Lilburn, GA: Fairmont Press)
24. Stoney G G 1909 Proc. R. Society A 82 172-5
25. Freund L B and Suresh S 2003 Thin Film Materials: Stress, Defect Formation and Surface Evolution (Cambridge: Cambridge University Press)
26. Chen K S, Zhang X and Lin S Y 2003 Thin Solid Films 434 190-202
27. Tabata O, Kawahata K, Sugiyama S and Igarashi I 1989 Sensors Actuators 20 135-41
28. Weaver W, Timoshenko S P and Young D H 1990 Vibration Problems in Engineering 5th edn (New York: Wiley-Interscience)