Lead-free solders in IC manufacture: A review

Russian Microelectronics

Volumn 32, Issue 4, 2003, Pages 247-256

  Zenin, V V ^a   Belyaev, V N ^b   Segal, Yu E ^b   Kolbenkov, A A ^c  

^a VORONEZH STATE TECHNICAL UNIVERSITY   (Russian Federation)

^b Elektronika Engineering Consultancy   (Russian Federation)

^c OAO Voronezh Semiconduct DFP   (Russian Federation)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; CORROSION PREVENTION; CRACKS; ECOLOGY; PLASTICITY; PROBLEM SOLVING; REACTION KINETICS; SOLDERING ALLOYS; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THICKNESS CONTROL; TIN ALLOYS;

LEAD-FREE SOLDERS; MELTING POINTS; MOMENTUM;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 3543081128     PISSN: 10637397     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1024579616706     Document Type: Review

References (21)

1. Krempelsauer, E., Bleifrei Ioten Silber und Kupfer statt Blei, Elektor (BRD), 2000, no. 5, pp. 14-15.
2. Beine, H., Bleifrei Aktuell, Productronic, 1999, no. 12, p. 18.
3. Grigor'ev, V.A., Lead-Free Technologies: Necessity or Obsession? Elektron. Komponenty, 2001, no. 6, pp. 72-78.
4. Belyaev, V.N., Zenin, V.V., Polner, G.L., and Segal, Yu.E., Lead-Free Solders for Microelectronics, in Tverdotel'naya elektronika i mikroelektronika (Solid-State Electronics and Microelectronics), Voronezh, 2001, pp. 71-77.
5. Tugov, N.M., Glebov, B.A., and Charykov, N.A., Poluprovodnikovye pribory: Uchebnik dlya vuzov (Semiconductor Devices: A University Textbook), Labuntsov, V.A., Ed., Moscow: Energoatomizdat, 1990.
6. Tushinskii, V.L., Bright Sn-Bi Plating of Semiconductor-Device Packages, Elektron. Tekh., Ser. 7, 1980, issue 5, pp. 28-32.
7. Skominas, V.Yu., Sn-Bi Plating with the Limeda-20 Electrolyte, in Elektroliticheskoe pokrytie splavami (Alloy Plating), Moscow: MDNTI, 1975, pp. 5-9.
8. Karimova, I.M., Characterization of Electrodeposited Sn-Bi Films, Elektron. Tekh., Ser. 2, 1974, issue 4, pp. 93-100.
9. Kovalenko, L.G., Sn-Bi Alloy Plating, Inform. Spravochn. Listok NIIER, 1968, no. 018 093.
10. Maslov, Yu.P., Myasnitskii, G.A., Nepomnyashchii, V.I., et al., PCS Manufacture, Obmen Opytom Radiopromsti, 1968, issue 8, p. 18.
11. Golubenko, T.K., Shchelchkov, A.A., Kochinova, M.N., et al., Study of the Solderability of Sn-Bi Plating, in Novaya tekhnologiya gal'vanicheskikh pokrytii: Tezisy dokl. k soveshchaniyu (Advanced Plating Technologies: Abstracts of Meeting Papers), Kirov, 1974, pp. 98-100.
12. Vol, A.Ya. and Kagan, I.K., Stroenie i svoistva dvoinykh metallicheskikh sistem (Structure and Properties of Binary Metal Systems), Moscow: Nauka, 1976, vol. 3.
13. Buechel, R., Die Bonding Technology, in Technical Bulletin D-AN-017-783 for Detailed Information of Some of the Most Common Used Die Attach Alloys for Power Devices, Esec Japan Co., 1984, p. 67.
14. Lyashok, A.P., Grachev, A.A., Zakirov, R.G., and Zuev, I.V., Welding or Soldering Package Closure of Discrete Semiconductor Devices and ICs: A Review, Elektron. Tekh., Ser. 7, 1977, issue 8.
15. Vorob'evskii, P.K., Zenin, V.V., Shevtsov, A.I., and Ipatova, M.M., Cassette Assembly of Power Transistors, Elektron. Tekh., Ser. 7, 1979, issue 4, pp. 29-32.
16. Zenin, V. V., Soft-Solder Bonding of Ultrathin Gold Wire to Bonding Pads in Hybrid ICs and Microassemblies, in Tverdotel'naya elektronika i mikroelektronika (Solid-State Electronics and Microelectronics), Voronezh: VGTU, 1997, pp. 88-94.
17. Rozov, V.V., Interaction Kinetics between Soft Solders and Gold, Elektron. Tekh., Ser. 6, 1973, issue 5, pp. 85-88.
18. Zenin, V.V., Bataev, S.V., and Cherayshov, A.V., Facility for the Study of the Dissolution of Ultrathin Gold Wire in Molten Soft Solders, Elektron. Tekh., Ser. 7, 1989, issue 4, pp. 57-59.
19. Segal, Yu.E., Zenin, V.V., and Kolbenkov, A.A., Solder Bonding of Hybrid-IC Substrates to Metal Bases, Peterb. Zh. Elektron., 1999, no. 3, pp. 51-58.
20. Malyshev, V.M. and Rumyantsev, D.V., Zoloto (Gold), Moscow: Metallurgiya, 1979.
21. Chistyakov, Yu.D. and Yakovlev, G.A., Improving the Reliability of Soft-Solder Bonding by Physical and Chemical Methods: A Review, Elektron. Tekh., Ser. 7, 1979, issue 2.