Progress in the integration of planar and 3D Coils on LTCC by using photoimageable inks

Advancing Microelectronics

Volumn 32, Issue 2, 2005, Pages 6-9

  Perrone, Rubén ^a   Thust, Heiko ^a   Drüe, Karl Heinz ^a  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Fodel inks; LTCC; Planar and 3 D coils; RF Properties

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; DIELECTRIC MATERIALS; ELECTRIC INDUCTORS; FREQUENCIES; INK; NETWORKS (CIRCUITS); SCREEN PRINTING;

FIRING PROCESS; MULTILAYER CIRCUITS; PHOTOIMAGEABLE INKS; ROOM TEMPERATURE;

ELECTRIC COILS;

CAPACITANCE; ELECTRIC COILS; FREQUENCIES;

EID: 21644465306     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. Tomáǎ Podprocký, Bjorn Vandecasteel, Johan De Baets, Andre Van Calster, "Thick film inductors for RF Applications," 14th European Microelectronics and Packaging Conference & Exhibition, Friedrichshafen, Germany, 23-25 June 2003.
2. R. Perrone, M. Hintz, K-H. Drüe, R. Münnich and H. Thust, "Photostrukturierte Elemente und Leitungen in LTCC," PLUS, January 2004, Band 6, No1, pp. 126-132.
3. Karl-Heinz Drüe, Torsten Theleman and Heiko Thust, "Laser Processing of LTCC with different Machine Concepts," 14th European Microelectronics and Packaging Conference & Exhibition, Friedrichshafen, Germany, 23-25 June 2003.
4. I. Bahl, "Lumped Elements for RF and microwave circuits," Boston: Artech House Inc., p. 70, 2003.
5. Jens Müller, "Entwurf, Herstellung und HF-Charakterisierung gedruckter passiver Bauelemente und Strukturen in LTCC," Technlsche Universität Ilmenau, 1996.
6. Richard K. Ulrich and Leonard W. Schaper, "Integrated Passive Component Technology," IEEE Press, p. 212, 2003.