An overview of integrated component technologies

Advancing Microelectronics

Volumn 30, Issue 3, 2003, Pages 9-13

  Nørlyng, Søren ^a  

^a MICRONSULT ^*  (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; INTEGRATED CIRCUITS; PRINTED CIRCUIT BOARDS; SUBSTRATES;

ACTIVE DEVICES; COST REDUCTIONS; MINIATURIZATION;

MICROELECTRONICS;

EID: 2342589005     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (18)

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2. Portelligent, USA. Teardown/Disassembly Reverse-Engineering Report "Ericsson T66 GSM Mobile Phone," March 2002
3. Prismark Wireless Technology Report. "EPCOS front end module -key component in new Nokia architecture," October 2002
4. K. Vaesen et al., IMEC, Belgium. 'Integrated passives for a DECT VCO." International Journal of Microcircuits & Electronic Packaging, Vol. 23, Q3, 2000, IMAPS, USA
5. In-ho Jeong et al., Telephus, Korea. "High Quality RF Passive Integration using 35μm Thick Oxide Manufacturing Technology." ECTC, IEEE, 2002, San Diego, USA
6. Y. Sugaya et al., Matsushita Electric Co., Ltd., Japan. "A new 3-D module using embedded actives and passives," Proceedings IMAPS-US, Baltimore, 2001
7. www.ohmega.com/pdfs/
8. K. Nagai et al., Asahi Chemical Research Laboratory Co., Ltd. Japan. "Development of PTF materials for buried passive components." Proceedings 3rd Pori electronics Production and Packaging Technology Conference, Pori, Finland, May 2002.
9. Jiming Zhou et al., Delphi Delco Electronics Systems, USA. "Embeddedpassives technology for PCBs: materials, design and process." NEMI project paper, May 2002.
10. William Borland et al., DuPont Microcircuit Materials, USA. "Embedded singulated ceramic passives inside PWBs." IMAPS ATW on Passive Integration, June 2002, USA.
11. Joe D'Ambrisi et al., MacDermid. Inc., USA. "Plated embedded resistors for high speed circuit applications." IPC Fall Annual Meeting, Orlando, USA, Oct. 2001
12. Peter Sandborn, CALCE Electronic Products and Systems Center, University of Maryland, USA. "Analysis of the cost of embedded passives in printed circuit boards." CALCE 2001
13. B. Etienne, CALCE Electronic Products and Systems Center, University of Maryland, USA. "Application-specific economic analysis of integral passives." CALCE 2001
14. Clint Beliveau, IBM Beaverton, USA. "Applications using buried resistor technology." Ohmega white paper, www.ohmega.com
15. John Rector, IBM, USA. "Economic and technical viability of integral passives." Proceedings Advanced Packaging Materials Processes, Properties and Interfaces, IMAPS, Braselton, Georgia, USA, USA 2001
16. A. Ostmann, FhG-IZM, Germany. "Chip in Polymer - the next step in miniaturization" Advancing Microelectronics, May-June 2002, IMAPS, US
17. E. Jung, FhG-IZM, Germany. "Ultra thin chips for miniaturised products." IEEE ECTC, USA, 2002
18. N. Pulsford, Philips, Holland. "Passive integration technology: targeting small, accurate RF parts." www.rfdesign.com, Nov. 2002, USA