The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging

JOM

Volumn 56, Issue 6, 2004, Pages 39-43

  Kim, Keun Soo ^a   Suganuma, Katsuaki ^a   Kim, Jong Min ^b   Hwang, Chi Won ^a  

^a OSAKA UNIVERSITY   (Japan)

^b Chung Ang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; METALLOGRAPHIC MICROSTRUCTURE; PRINTED CIRCUIT MANUFACTURE; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SOLIDIFICATION; TEMPERATURE DISTRIBUTION; THERMAL STRESS; TIN ALLOYS;

LEAD FREE SOLDERS; MICROSTRUCTURAL OBSERVATIONS; TIN SILVER COPPER SOLDER SOLIDIFICATION;

SOLDERING ALLOYS;

EID: 3242762363     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-004-0109-3     Document Type: Article

References (12)

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