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Journal of Raman Spectroscopy

Volumn 38, Issue 2, 2007, Pages 250-253

A method for measuring bending stresses based on electromagnetic actuation and Raman spectroscopy

(5) Ren, Yongfeng a Xu, Wenqiang a Xue, Chenyang a Zhang, Wendong a Zheng, Lina a

a NORTH UNIVERSITY OF CHINA (China)

Author keywords

Bending stresses; Electromagnetic actuation; Fracture strength; MEMS; Micro Raman spectroscopy

Indexed keywords

ELECTROMECHANICAL DEVICES; FRACTURE; FRACTURE TOUGHNESS; RAMAN SPECTROSCOPY;

BENDING STRESS; ELECTROMAGNETIC ACTUATION; LIFESPANS; MASS STRUCTURE; MEASUREMENT METHODS; MICRO RAMAN SPECTROSCOPY; MICROELECTROMECHANICAL SYSTEM DESIGN; MICROMACHINED STRUCTURES; STRESSES MEASUREMENTS;

MEMS;

EID: 33947177539 PISSN: 03770486 EISSN: 10974555 Source Type: Journal
DOI: 10.1002/jrs.1649 Document Type: Article

Times cited : (2)

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