ESPI solution for non-contacting MEMS-on-wafer testing

Optics and Lasers in Engineering

Volumn 40, Issue 5-6, 2003, Pages 501-515

  Aswendt, Petra ^a   Schmidt, Claus Dieter ^a   Zielke, Dirk ^b   Schubert, Steffen ^b  

^a FRAUNHOFER INSTITUTE FOR MACHINE TOOLS AND FORMING TECHNOLOGY IWU   (Germany)

^b GEMAC MbH   (Germany)

Author keywords

Electronic speckle pattern interferometry; MEMS characterization; Non destructive testing; Quality assurance; Vibration measurement

Indexed keywords

IMAGE ANALYSIS; MICROELECTROMECHANICAL DEVICES; QUALITY ASSURANCE; SPECKLE; VIBRATION MEASUREMENT;

ELECTRONIC SPECKLE PATTERN INTERFEROMETRY (ESPI);

INTERFEROMETRY;

EID: 0038010472     PISSN: 01438166     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-8166(02)00086-6     Document Type: Article

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