Coupled power and thermal simulation with active cooling

Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics)

Volumn 3164, Issue , 2004, Pages 148-163

  Liao, Weiping ^a   He, Lei ^a  

^a University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER ARCHITECTURE; COOLING; COOLING SYSTEMS; THERMAL MANAGEMENT (ELECTRONICS); POWER MANAGEMENT; VOLTAGE SCALING;

ACTIVE COOLING; COOLING TECHNIQUE; COUPLED POWER; LEAKAGE POWER; MICRO ARCHITECTURES; POWER MODELING; POWER SIMULATION; TEMPERATURE CALCULATION; THERMAL RUNAWAYS; THERMAL SIMULATIONS; LEAKAGE ENERGIES; TEMPERATURE DEPENDENT; THERMAL CONSTRAINTS;

VOLTAGE SCALING; COOLING;

EID: 33947162957     PISSN: 03029743     EISSN: 16113349     Source Type: Book Series    
DOI: None     Document Type: Article

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