Fabrication and characterization of smooth Si mold for hot embossing process

IEEJ Transactions on Sensors and Micromachines

Volumn 127, Issue 3, 2007, Pages

  Pham, Phuc Hong ^a   Dao, Dzung Viet ^a,c   Amaya, Satoshi ^b   Kitada, Ryoji ^b   Sugiyama, Susumu ^a,c  

^a RITSUMEIKAN UNIVERSITY   (Japan)

^b TOWA Corporation   (Japan)

^c Ritsumei   (Japan)

Author keywords

DRIE process; Hot embossing technique; PMMA; Post passivation technique; Silicon mold; TMAH wet etching

Indexed keywords

ETCHING; POLYMETHYL METHACRYLATES; SILICON; SILICON WAFERS;

DRIE PROCESS; HOT EMBOSSING TECHNIQUE; POST-PASSIVATION TECHNIQUE; SILICON MOLD; TMAH WET ETCHING;

MOLDS;

EID: 33847698481     PISSN: 13418939     EISSN: 13475525     Source Type: Journal    
DOI: 10.1541/ieejsmas.127.187     Document Type: Conference Paper

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