The effect of toughening of no-flow underfill on fillet cracking of flip-chip device

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2001, Pages 333-340

  Moon, K S ^a   Fan, L ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; DYNAMIC MECHANICAL ANALYSIS; FRACTURE TOUGHNESS; POLYCARBONATES; SCANNING ELECTRON MICROSCOPY;

FILLET CRACKING;

CHIP SCALE PACKAGES;

EID: 0035017649     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)