Effects of low-modulus die attach adhesive on warpage and damage of BGA

Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging

Volumn 2005, Issue , 2005, Pages 162-168

  Yi, Sung ^a   Daharwal, Paresh D ^b   Lee, Yeong J ^c   Harkness, Brian R ^d  

^a Department of Electrical and Computer Engineering   (United States)

^b INTEL CORPORATION   (United States)

^c MOTOROLA INC   (United States)

^d DOW CHEMICAL COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAY (BGA) PACKAGES; DIE CRACKING; MATERIAL PROPERTIES; THERMOMECHANICAL PROPERTIES;

DEFORMATION; ELECTRONICS PACKAGING; PARAMETRIC DEVICES; SHEET MOLDING COMPOUNDS; SUBSTRATES; SUPERCONDUCTING TRANSITION TEMPERATURE; THERMOMECHANICAL TREATMENT;

ADHESIVES;

EID: 33847305869     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2005.1598254     Document Type: Conference Paper

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