Warpage analysis of 144-pin TQFP during reflow using image processing

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 1176-1181

  Zheng, Dawei ^a   Hwang, Ray P ^a   Dou, Xinyu ^a   Yeh, Chaopin ^a   Prakash, Mani ^a   Boardman, Keith ^a   Ridsdale, Greg ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COMPUTER SOFTWARE; IMAGE ANALYSIS; IMAGE PROCESSING; IMAGE QUALITY; INTERFEROMETERS; MOIRE FRINGES; PATTERN RECOGNITION;

SHADOW MOIRE; THIN QUAD FLAT PACKAGE (TQFP); TWYMAN GREEN; WARPAGE ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0030654939     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)