Thermo-mechanical deformation of underfilled flip-chip packaging

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 326-333

  Dai, Xiang ^a   Ho, Paul S ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTERFEROMETRY; SHEAR STRESS; THERMAL EFFECTS; THERMAL EXPANSION; THERMAL LOAD;

SHEAR STRAINS; THERMOMECHANICAL DEFORMATIONS;

ELECTRONICS PACKAGING;

EID: 0031383245     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)