Lead-free: Electrical influence on tin whisker growth

SMT Surface Mount Technology Magazine

Volumn 20, Issue 9, 2006, Pages 41-42

  Fukuda, Yuki ^a,b   Osterman, Michael ^a   Pecht, Michael ^a  

^a CALCE ^*  (United States)

^b Philips Lumileds Lighting Company   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33845704564     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (6)

1. Ganesan, S., and M. Recht, "Lead-free Electronics," John Wiley and Sons, Inc., 2006.
2. Hilty, R. D., N. E. Corman, and H. Herrman, "Electrostatic Fields and Current-flow Impact on Whisker Growth," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 28, No. 1, pp. 75-84, January 2005.
3. Liu, S. H., C. Chen, P. C. Liu, and T. Chou, "Tin Whisker Growth Driven by Electrical Currents," Journal of Applied Physics, Vol. 95, No. 12, pp. 7742-7747, June 2004.
4. th Int'l Conference on Lead-free Electronic Components and Assemblies, April 2005.
5. "Recommendations on Lead-free Finishes for Components Used in High-Reliability Products," iNEMI, May 2005.
6. "Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," JEDEC Standard 22A121, May 2005.