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Volumn , Issue , 2005, Pages 61-65

A tin whisker risk assessment algorithm

Author keywords

Distribution; Risk; Tin whisker; Whisker growth

Indexed keywords

DISTRIBUTION; ELECTRICALLY CONDUCTIVE; ELECTRONIC MANUFACTURER; GLOBAL TRANSITIONS; PROBABILISTIC APPROACHES; STATISTICAL DISTRIBUTION; TIN WHISKER; WHISKER GROWTH;

EID: 84876898392     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (8)

References (9)
  • 1
    • 15744364842 scopus 로고    scopus 로고
    • Edition, CALCE EPSC Press, University of Maryland, College Park, MD
    • S. Ganesan and M. Pecht, Lead-free Electronics, 2004 Edition, CALCE EPSC Press, University of Maryland, College Park, MD.
    • (2004) Lead-free Electronics
    • Ganesan, S.1    Pecht, M.2
  • 2
    • 0038140902 scopus 로고    scopus 로고
    • Tin whisker observations on pure tin-plated ceramic chip capacitors
    • June 24-27
    • J. Brusse, "Tin Whisker Observations on Pure Tin-plated Ceramic Chip Capacitors", AESF SUR/FIN Proceedings, June 24-27, 2002.
    • (2002) AESF SUR/FIN Proceedings
    • Brusse, J.1
  • 3
    • 0032083872 scopus 로고    scopus 로고
    • Spontaneous growth mechanism of tin whiskers
    • B.Z. Lee and D.N. Lee, "Spontaneous Growth Mechanism of Tin Whiskers", Acta Materials, Vol. 46, No. 10, pp. 3701-3714, 1998.
    • (1998) Acta Materials , vol.46 , Issue.10 , pp. 3701-3714
    • Lee, B.Z.1    Lee, D.N.2
  • 4
    • 20444391144 scopus 로고    scopus 로고
    • Understanding whisker phenomenon: The driving force for whisker formation
    • May
    • C. Xu, Y. Zhang, C. Fan, and J. Abys, "Understanding Whisker Phenomenon: The Driving Force for Whisker Formation", CircuiTree, pp. 10-21, May 2002.
    • (2002) CircuiTree , pp. 10-21
    • Xu, C.1    Zhang, Y.2    Fan, C.3    Abys, J.4
  • 6
    • 84876913049 scopus 로고    scopus 로고
    • Field reliability estimation of tin whiskers generated by thermal-cycling stress
    • Ltd
    • S. Okada, S. Higuchi, and T. Ando, "Field Reliability Estimation of Tin Whiskers Generated by Thermal-Cycling Stress", Murata Manufacturing Corporation, Ltd, 2003.
    • (2003) Murata Manufacturing Corporation
    • Okada, S.1    Higuchi, S.2    Ando, T.3
  • 7
    • 5444244980 scopus 로고    scopus 로고
    • Avoiding tin whisker reliability problems
    • Aug.
    • G.T. Galyon and R. Gedney, "Avoiding Tin Whisker Reliability Problems", Circuits Assembly, pp. 26-31, Aug. 2004.
    • (2004) Circuits Assembly , pp. 26-31
    • Galyon, G.T.1    Gedney, R.2
  • 8
    • 84876888488 scopus 로고    scopus 로고
    • Statistical analysis of tin whisker growth
    • Accepted for Publication on May 9th
    • T. Fang, M. Osterman, and M. Pecht, "Statistical Analysis of Tin Whisker Growth", Microelectronics Reliability, Accepted for Publication on May 9th, 2005.
    • (2005) Microelectronics Reliability
    • Fang, T.1    Osterman, M.2    Pecht, M.3
  • 9
    • 33645161897 scopus 로고    scopus 로고
    • NEMI tin whisker user group - Tin whisker acceptance test requirements
    • June 1-2 Las Vegas, NV
    • J. Smetana, "NEMI Tin Whisker User Group - Tin Whisker Acceptance Test Requirements", NEMI Tin Whisker Workshop, June 1-2, 2004, Las Vegas, NV.
    • (2004) NEMI Tin Whisker Workshop
    • Smetana, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.