Assessing Tin Whisker risk in electronic products

SMT Surface Mount Technology Magazine

Volumn 20, Issue 5, 2006, Pages

  Fang, Tong ^a   Mathew, Sony ^b   Osterman, Michael ^c   Pecht, Michael ^c  

^a Vitesse Semiconductor Corporation   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

^c CALCE ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33845889089     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (5)

1. S. Ganesan and M. Pecht, Lead-free Electronics, Wiley-Interscience, N.Y., N.Y., 2006.
2. European Union, "Directive 2002/96/EC of the European Parliament and the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE)," Official Journal of the European Union, p. L37/24-38.
3. J. Brusse, "Tin Whisker Observations on Pure Tin-plated Ceramic Chip Capacitors", AESF SUR/FIN Proceedings, June 24-27, 2002.
4. th, 2006.
5. JEDEC Standard JESD22A121, "Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes," JEDEC Solid State Technology Association, May 2006, Arlington, Va.