Quilt packaging: A new paradigm for interchip communication

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 1, Issue , 2005, Pages 1-6

  Bernstein, Gary H ^a   Liu, Qing ^a   Sun, Zhuowen ^a   Fay, Patrick ^a  

^a University of Notre Dame   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTING NODULES; INTERCHIP COMMUNICATION; MULTICHIP MODULE;

COMPUTER SIMULATION; DIES; DIGITAL SIGNAL PROCESSING; ELECTRIC CONDUCTORS; ELECTRONICS PACKAGING; MICROPROCESSOR CHIPS;

INTEGRATED CIRCUIT LAYOUT;

EID: 33847253042     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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