Effects of printed circuit board materials on lead-free interconnect durability

Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Proceedings

Volumn 2005, Issue , 2005, Pages 140-144

  Qi, Haiyu ^a   Ganesan, Sanka ^a   Wu, Ji ^a   Pecht, Michael ^a   Matkowski, Przemyslaw ^b   Felba, Jan ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Coefficient of thermal expansion; Elastic modulus; FR4; Glass transition temperature; Lead free; Polyimide; Printed circuit board; Random vibration; Sinusoidal vibration; Solder joints; Temperature cycling

Indexed keywords

ASSEMBLY; DURABILITY; ELASTIC MODULI; GLASS TRANSITION; POLYIMIDES; SOLDERED JOINTS; SOLDERING;

COEFFICIENT OF THERMAL EXPANSION; FR4; LEAD-FREE; RANDOM VIBRATION; SINUSOIDAL VIBRATION; TEMPERATURE CYCLING;

PRINTED CIRCUIT BOARDS;

EID: 33847208137     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2005.1596504     Document Type: Conference Paper

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