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Volumn 416, Issue 1-2, 2006, Pages 74-79
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Fluxless flip-chip Sn-Au solder interconnect on thin Si wafers and Cu laminated polyimide films
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Author keywords
Flip chip interconnect; Fluxless bonding; Fluxless soldering; Sn Au alloys
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Indexed keywords
BONDING;
COPPER;
DIFFUSION;
ENERGY DISPERSIVE SPECTROSCOPY;
GLASS;
POLYIMIDES;
SCANNING ELECTRON MICROSCOPY;
SILICON WAFERS;
SOLDERED JOINTS;
SUBSTRATES;
COPPER LAMINATED POLYIMIDE FILMS;
FLIP-CHIP INTERCONNECT;
FLUXLESS BONDING;
FLUXLESS SOLDERING;
GLASS SUBSTRATE;
SOLDER BUMPS;
TIN ALLOYS;
BONDING;
COPPER;
DIFFUSION;
ENERGY DISPERSIVE SPECTROSCOPY;
GLASS;
POLYIMIDES;
SCANNING ELECTRON MICROSCOPY;
SILICON WAFERS;
SOLDERED JOINTS;
SUBSTRATES;
TIN ALLOYS;
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EID: 30844457269
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2005.09.084 Document Type: Article |
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Times cited : (27)
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References (11)
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