Interface reaction of solder droplet/pad and intermetallic compounds evolution during reflow soldering

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 15, Issue 10, 2005, Pages 1506-1511

  Li, Fu Quan ^a   Wang, Chun Qing ^a   Tian, Yan Hong ^a   Kong, Ling Chao ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Bump; Intermetallic compound; Lead free solder; Reflow; Solder droplet

Indexed keywords

EID: 28244474447     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (17)