Evaluation of the moisture sensitivity of molding compounds of ic’s packages

Journal of Electronic Packaging, Transactions of the ASME

Volumn 123, Issue 1, 2001, Pages 16-18

  Fremont H ^a   Deletage J Y ^a   Pintus, A ^a   Danto, Y ^a  

^a UNIVERSITÉ BORDEAUX 1   (France)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 16744365387     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.1326436     Document Type: Article

References (10)

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3. Shook, R. L., Conrad, T. R., Sastry, V. S., and Steele, D. B., 1996, “Diffusion model to derate sensitive surface mount IC’s for factory use conditions,” IEEE Trans. Compon. Packag. Manufact. Technol. Part C, 19, No. 2, pp. 110-118.
4. Shook, R. L., Vacaro, B. T., and Gerlach, D. L., 1998, “Method for equivalent acceleration of JEDEC/IPC moisture sensitivity levels,” Proc. of the IRPS.
5. Wong, E. H., Teo, Y. C., and Lim, T. B., 1998, “Moisture diffusion and vapor pressure modeling of IC packaging” Proc. of the 1998 Electronic Components and Technology Conference, pp. 1372-1378.
6. Holalkere, V., Mirano, S., Kuo, A. Y., and Chen, W. T., 1997, “Evaluation of plastic package delamination via reliability testing and fracture mechanism approach,” Proc. of the 1997 Electronic Components and Technology Conference, pp. 430-435.
7. Crank, J., 1975, The Mathematics of Diffusion, 2nd Ed., Oxford.
8. Cai, L. W., and Weistman, Y., 1994, “Non-Fickian moisture diffusion in polymeric composites,” J. Compos. Mater., 28, No. 2, pp. 130-154.
9. Rousseau, C., Lombaert-Valot, I., and Chopin, J. M., 1992, “Evolution of molding material of biased plastic package components aged by hygrothermic cycling,” IEEE/ISHM '92 Symposium, pp. 100-107.
10. Wong, T. C., and Broutman, L. J., 1985, “Moisture diffusion in epoxy resins,” Polym. Eng. Sci., Parts 1 and 2, 25, No. 9, June.