Electronic speckle pattern interferometry applied to the displacement measurement of sandwich plates with single 'fully potted' insert

Journal of Mechanics

Volumn 20, Issue 4, 2004, Pages 273-276

  Huang, S J ^a   Lin, H L ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Displacement; Electronic speckle pattern interferometry (ESPI); Insert; Sandwich plate

Indexed keywords

ADHESIVES; CHARGE COUPLED DEVICES; ELASTIC MODULI; ELASTICITY; FINITE ELEMENT METHOD; INTERFEROMETERS; MATHEMATICAL MODELS; NONDESTRUCTIVE EXAMINATION; SANDWICH STRUCTURES; SPECKLE; STRAIN;

ELECTRONIC SPECKLE PATTERN INTERFEROMETRY (ESPI); INSERTS; SANDWITCH PLATES; SURFACE DISPLACEMENT;

PLATES (STRUCTURAL COMPONENTS);

EID: 11244323941     PISSN: 17277191     EISSN: None     Source Type: Journal    
DOI: 10.1017/S172771910000349X     Document Type: Article

References (9)

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