Improvement of adhesion for layer-to-layer connection for build-up printed circuit boards

Transactions of the Institute of Metal Finishing

Volumn 78, Issue 4, 2000, Pages 140-142

  Honma, Hideo ^a   Ishibashi, Junichi ^a   Kobayashi, Takeshi ^a   Irisawa, Hiroki ^a  

^a KANTO GAKUIN UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); CONDUCTIVE MATERIALS; COPPER PLATING; DIELECTRIC MATERIALS; ELECTROLESS PLATING; ETCHING; POTASSIUM COMPOUNDS;

LAYER-TO-LAYER CONNECTION; POTASSIUM THIOCYANATE;

PRINTED CIRCUIT BOARDS;

EID: 0033721779     PISSN: 00202967     EISSN: None     Source Type: None    
DOI: 10.1080/00202967.2000.11871326     Document Type: Article

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