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Journal of Materials Processing Technology

Volumn 140, Issue 1-3 SPEC., 2003, Pages 358-362

Nano-precision measurement of diamond tool edge radius for wafer fabrication

(5) Li, X P a Rahman, M a Liu, K a Neo, K S a Chan, C C a

a NATIONAL UNIVERSITY OF SINGAPORE (Singapore)

Author keywords

Diamond tool; Edge radius; Measurement; Nano precision; Wafer fabrication

Indexed keywords

ATOMIC FORCE MICROSCOPY; BRITTLENESS; ELASTIC MODULI; ERROR COMPENSATION; INTERFEROMETRY; NANOSTRUCTURED MATERIALS; NONDESTRUCTIVE EXAMINATION; PARTICLE DETECTORS; PROFILOMETRY; SCANNING ELECTRON MICROSCOPY; YIELD STRESS;

NANO-PRECISION MEASUREMENTS; UNCOATED TOOLS;

DIAMOND CUTTING TOOLS;

EID: 0041909802 PISSN: 09240136 EISSN: None Source Type: Journal
DOI: 10.1016/S0924-0136(03)00757-X Document Type: Conference Paper

Times cited : (65)

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