Bottom-up filling using electrochemical oxidation on patterned wafers

Electrochemical and Solid-State Letters

Volumn 8, Issue 11, 2005, Pages

  Cha, Seung Hwan ^a   Kim, Seung Soo ^a   Cho, Sung Ki ^a   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; COPPER COMPOUNDS; ELECTROLYTES; ELECTROPLATING; INTEGRATED CIRCUITS; OXIDATION; THIN FILMS;

CU ELECTROPLATING; ELECTROCHEMICAL OXIDATION; PATTERNED WAFERS; SUPERCONFORMAL DEPOSITION;

ELECTROCHEMISTRY;

EID: 27744474561     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2063248     Document Type: Article

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