-
1
-
-
0024000967
-
The decohesion of thin films from brittle substrates
-
Hu MS, Thouless MD, Evans AG. The decohesion of thin films from brittle substrates. Acta Metall 1988;36(5):1301-7.
-
(1988)
Acta Metall
, vol.36
, Issue.5
, pp. 1301-1307
-
-
Hu, M.S.1
Thouless, M.D.2
Evans, A.G.3
-
2
-
-
0024061820
-
Residual stresses and cracking in brittle solids bonded with a thin ductile layer
-
Cao HC, Thouless MD, Evans AG. Residual stresses and cracking in brittle solids bonded with a thin ductile layer. Acta Metall 1988;36(8):2037-46.
-
(1988)
Acta Metall
, vol.36
, Issue.8
, pp. 2037-2046
-
-
Cao, H.C.1
Thouless, M.D.2
Evans, A.G.3
-
3
-
-
0024934204
-
On crack path selection and the interface fracture energy in bimaterial system
-
Evans AG, Dalgleish BJ, He M, Huchinson JW. On crack path selection and the interface fracture energy in bimaterial system. Acta Metall 1989;37(12):3249-54.
-
(1989)
Acta Metall
, vol.37
, Issue.12
, pp. 3249-3254
-
-
Evans, A.G.1
Dalgleish, B.J.2
He, M.3
Huchinson, J.W.4
-
4
-
-
0024056874
-
On the decohesion of residually stressed thin films
-
Drory MD, Thouless MD, Evans AG. On the decohesion of residually stressed thin films. Acta Metall 1988;36(8):2019-28.
-
(1988)
Acta Metall
, vol.36
, Issue.8
, pp. 2019-2028
-
-
Drory, M.D.1
Thouless, M.D.2
Evans, A.G.3
-
5
-
-
0024069796
-
The cracking and decohesion of thin films
-
Evans AG, Drory MD, Hu MS. The cracking and decohesion of thin films. J Mater Res 1988;3(5):1043-9.
-
(1988)
J Mater Res
, vol.3
, Issue.5
, pp. 1043-1049
-
-
Evans, A.G.1
Drory, M.D.2
Hu, M.S.3
-
6
-
-
71149121504
-
Mixed mode cracking in layered materials
-
Hutchinson JW, Suo Z. Mixed mode cracking in layered materials. Adv Appl Mech 1992;29:63-191.
-
(1992)
Adv Appl Mech
, vol.29
, pp. 63-191
-
-
Hutchinson, J.W.1
Suo, Z.2
-
7
-
-
0027045651
-
Thin film cracking and the roles of substrate and interface
-
Ye T, Suo Z, Evans AG. Thin film cracking and the roles of substrate and interface. Int J Solids Struct 1992;29(21):2639-48.
-
(1992)
Int J Solids Struct
, vol.29
, Issue.21
, pp. 2639-2648
-
-
Ye, T.1
Suo, Z.2
Evans, A.G.3
-
8
-
-
0026692234
-
Cracking of thin bonded films in residual tension
-
Beuth Jr JL. Cracking of thin bonded films in residual tension. Int J Solids Struct 1992;29(13):1657-75.
-
(1992)
Int J Solids Struct
, vol.29
, Issue.13
, pp. 1657-1675
-
-
Beuth J.L., Jr.1
-
9
-
-
0026835910
-
Three-dimensional effects in thin film fracture mechanics
-
Nakamura T, Kamath SM. Three-dimensional effects in thin film fracture mechanics. Mech Mater 1992;13:67-77.
-
(1992)
Mech Mater
, vol.13
, pp. 67-77
-
-
Nakamura, T.1
Kamath, S.M.2
-
10
-
-
0029346335
-
The thermomechanical integrity of thin films and multilayers
-
Evans AG, Hutchinson JW. The thermomechanical integrity of thin films and multilayers. Acta Metall 1995;43(7):2507-30.
-
(1995)
Acta Metall
, vol.43
, Issue.7
, pp. 2507-2530
-
-
Evans, A.G.1
Hutchinson, J.W.2
-
11
-
-
85008269051
-
Tow edge-bonded elastic wedges of different materials and wedge angles under surface tractions
-
Bogy DB. Tow edge-bonded elastic wedges of different materials and wedge angles under surface tractions. ASME J Appl Mech 1971;38:377-86.
-
(1971)
ASME J Appl Mech
, vol.38
, pp. 377-386
-
-
Bogy, D.B.1
-
12
-
-
0015112941
-
Stress singularities at interface concerns in bonded dissimilar isotropic elastic materials
-
Bogy DB, Wang KC. Stress singularities at interface concerns in bonded dissimilar isotropic elastic materials. J Solids Struct 1971;7:993-1005.
-
(1971)
J Solids Struct
, vol.7
, pp. 993-1005
-
-
Bogy, D.B.1
Wang, K.C.2
-
13
-
-
0001361385
-
Characterization of thermal stresses in ceramic/metal-joints
-
The University of Tokyo (B)
-
Mizuno K, Miyazawa K, Suga T. Characterization of thermal stresses in ceramic/metal-joints. J Faculty of Engineering, The University of Tokyo (B) 1988;39:401-12.
-
(1988)
J Faculty of Engineering
, vol.39
, pp. 401-412
-
-
Mizuno, K.1
Miyazawa, K.2
Suga, T.3
-
14
-
-
0027002427
-
Stress Singularities at the interface in bonded dissimilar materials under mechanical and thermal loading
-
Munz D, Yang YY. Stress Singularities at the interface in bonded dissimilar materials under mechanical and thermal loading. ASME J Appl Mech 1992;59:857-61.
-
(1992)
ASME J Appl Mech
, vol.59
, pp. 857-861
-
-
Munz, D.1
Yang, Y.Y.2
-
15
-
-
0025638133
-
Intensity of the stress singularity at the interface corner between a bonded elastic and rigid layer
-
Reedy Jr ED. Intensity of the stress singularity at the interface corner between a bonded elastic and rigid layer. Eng Fract Mech 1990;36(4):575-83.
-
(1990)
Eng Fract Mech
, vol.36
, Issue.4
, pp. 575-583
-
-
Reedy E.D., Jr.1
-
16
-
-
0027665950
-
Free-edge stress intensity factor for a bonded ductile layer subjected to shear
-
Reedy Jr ED. Free-edge stress intensity factor for a bonded ductile layer subjected to shear. ASME J Appl Mech 1993;60:715-20.
-
(1993)
ASME J Appl Mech
, vol.60
, pp. 715-720
-
-
Reedy E.D., Jr.1
-
17
-
-
0027795353
-
Comparison of butt tensile strength data with interface corner stress intensity factor prediction
-
Reedy Jr ED, Guess TR. Comparison of butt tensile strength data with interface corner stress intensity factor prediction. Int J Solids Struct 1993;21(21):2929-36.
-
(1993)
Int J Solids Struct
, vol.21
, Issue.21
, pp. 2929-2936
-
-
Reedy E.D., Jr.1
Guess, T.R.2
-
18
-
-
0033899251
-
Connection between interface corner and interfacial fracture analyses of an adhesively-bonded butt joint
-
Reedy Jr ED. Connection between interface corner and interfacial fracture analyses of an adhesively-bonded butt joint. Int J Solids Struct 2000;37:2429-42.
-
(2000)
Int J Solids Struct
, vol.37
, pp. 2429-2442
-
-
Reedy E.D., Jr.1
-
19
-
-
0002532941
-
A method for assessing the mechanical reliability of low-K polymeric dielectric materials
-
O. Havemann, editor. Proc MRS, Boston, MA
-
Shaffer II EO, Townsend PH, Im J. A method for assessing the mechanical reliability of low-K polymeric dielectric materials, in: O. Havemann, editor. Proc MRS, Adv Met and Interconnect Systems for ULSI. Boston, MA, 1996. p. 429-35.
-
(1996)
Adv Met and Interconnect Systems for ULSI
, pp. 429-435
-
-
Shaffer E.O., II.1
Townsend, P.H.2
Im, J.3
-
20
-
-
0002717274
-
Physical and mechanical properties determination of photo-BCB-based thin films
-
Minneapolis, MN, October
-
Im J, Shaffer II EO, Rey PT, Murlick C, Sammler RL. Physical and mechanical properties determination of photo-BCB-based thin films. Proc ISHM, Minneapolis, MN, October 1996. p. 168-75.
-
(1996)
Proc ISHM
, pp. 168-175
-
-
Im, J.1
Shaffer E.O., II.2
Rey, P.T.3
Murlick, C.4
Sammler, R.L.5
-
21
-
-
0033737061
-
On the design of debond-resistant bimaterials, Part I: Free-edge singularity approach and Part II: A comparison of free-edge and interface crack approaches
-
pp. 111-128
-
Klingbeil NW, Beuth JL. On the design of debond-resistant bimaterials, Part I: Free-edge singularity approach and Part II: A comparison of free-edge and interface crack approaches. Eng Fract Mech 2000;66:93-110, and pp. 111-28.
-
(2000)
Eng Fract Mech
, vol.66
, pp. 93-110
-
-
Klingbeil, N.W.1
Beuth, J.L.2
-
23
-
-
85024597150
-
Discussion of edge-bonded dissimilar orthogonal elastic wedges under normal and shear loading
-
Dundurs J. Discussion of edge-bonded dissimilar orthogonal elastic wedges under normal and shear loading. ASME J Appl Mech 1969;36:650-2.
-
(1969)
ASME J Appl Mech
, vol.36
, pp. 650-652
-
-
Dundurs, J.1
-
24
-
-
0035440672
-
Thermal and mechanical characterization of ViaLux 81: A novel epoxy photo-dielectric dry film (PDDF) for microvia applications
-
Dunne RC, Sitaraman SK, Luo S, Wong CP, Estes WE, Periyasamy M, Coburn JC. Thermal and mechanical characterization of ViaLux 81: A novel epoxy photo-dielectric dry film (PDDF) for microvia applications. IEEE Trans Compon Pack Technol 2001;24(3):436-44.
-
(2001)
IEEE Trans Compon Pack Technol
, vol.24
, Issue.3
, pp. 436-444
-
-
Dunne, R.C.1
Sitaraman, S.K.2
Luo, S.3
Wong, C.P.4
Estes, W.E.5
Periyasamy, M.6
Coburn, J.C.7
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