Thermal management of microelectronics in the 21st century

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 29-33

  Bar Cohen, Avram ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; HEAT FLUX; HEAT RESISTANCE; HEAT SINKS; INTEGRATED CIRCUIT MANUFACTURE; TECHNOLOGICAL FORECASTING;

AIR COOLED HEAT SINKS; PASSIVE IMMERSION MODULES; THERMAL PACKAGING TECHNOLOGY;

MICROELECTRONICS;

EID: 0031324966     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)