An overview of thermal management for next generation microelectronic devices

ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

Volumn 2003-January, Issue , 2003, Pages 250-254

  Tonapi, S S ^a   Fillion, R A ^a   Schattenmann, F J ^a   Cole, H S ^a   Evans, J D ^a   Sammakia, B G ^b  

^a GE GLOBAL RESEARCH   (United States)

^b BINGHAMTON UNIVERSITY   (United States)

Author keywords

Aerospace materials; Costs; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Microelectronics; Power dissipation; Power system management; Thermal management; Thermal management of electronics

Indexed keywords

CHIP SCALE PACKAGES; CONSUMER ELECTRONICS; COSTS; ELECTRONIC COOLING; ELECTRONICS PACKAGING; ENERGY DISSIPATION; INTERFACES (MATERIALS); MANUFACTURE; MICROELECTRONICS; PACKAGING MATERIALS; SEMICONDUCTOR DEVICE MANUFACTURE; THERMAL VARIABLES CONTROL;

AEROSPACE ELECTRONICS; AEROSPACE MATERIALS; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; ELECTRONICS COOLING; HIGH-END SYSTEMS; MICRO-ELECTRONIC DEVICES; POWER SYSTEM MANAGEMENT; THERMAL INTERFACE MATERIALS;

TEMPERATURE CONTROL;

EID: 84941797295     PISSN: 10788743     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASMC.2003.1194502     Document Type: Conference Paper

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