Interfacial thermal resistance and temperature dependence of three adhesives for electronic packaging

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 4, 2000, Pages 633-637

  Hasselman, D P H ^b   Donaldson, Kimberly Y ^b   Barlow, Fred D ^c   Elshabini, Aicha A ^a,c   Schiroky, Gerhard H ^d   Yaskoff, Josh P ^e   Dietz, Raymond L ^f  

^a IEEE

^b Virginia Polytechnic Institute and State University   (United States)

^c University of Arkansas   (United States)

^d Lanxide Electronic Components Inc   (United States)

^e GE ENERGY   (United States)

^f Diemat Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ALUMINUM; HEAT RESISTANCE; INTERFACES (MATERIALS); SILICON CARBIDE; SPECIFIC HEAT; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY; THERMAL DIFFUSION;

INTERFACIAL THERMAL RESISTANCE; LASER FLASH METHOD; TEMPERATURE DEPENDENCE;

ELECTRONICS PACKAGING;

EID: 0034476381     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.888846     Document Type: Article

References (9)

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