TAMI analysis of flip chip packages: Tomographic acoustic micro imaging offers a practical alternative to conventional imaging methodology

Advanced Packaging

Volumn 7, Issue 6, 1998, Pages 50-54

  Sigmund, Joel ^a   Kearney, Michael ^a  

^a Sonix Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 11644256689     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (2)

1. J. Semmens, L. Kassler, "Characterization of Flip Chip Interconnect Failure Modes Using High Frequency Acoustic Micro Imaging With Correlative Analysis," Sonoscan Inc., Bensenville, III., p. 1-8.
2. O. Diaz de Leon, M. Nassirian, R. Chowdhury, C. Todd, "Failure Analysis of Flip Chip Interconnections Through Acoustic Microscopy," Texas Instruments Inc., Houston, Texas, p. 1-6.