A projection moiré system for measuring warpage with case studies

International Journal of Microcircuits and Electronic Packaging

Volumn 25, Issue 1, 2005, Pages 15-26

  Ding, Hai ^a   Powell, Reinhard E ^a   Ume, I Charles ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Optical Metrology; Phase Stepping; Phase Unwrapping; Printed Wiring Board; Projection Moire; Thermal Warpage

Indexed keywords

OPTICAL METROLOGY; PHASE STEPPING; PHASE UNWRAPPING; PRINTED WIRING BOARD; PROJECTION MOIRE; THERMAL WARPAGE;

CHIP SCALE PACKAGES; INTEGRATED CIRCUITS; LIGHT; LIGHT SOURCES; PRINTED CIRCUIT BOARDS; SIGNAL NOISE MEASUREMENT; STRESS ANALYSIS;

PACKAGING;

EID: 33845588143     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. K.J. Gasvik, "Optical Metrology", Second Ed., John Wiley & Sons, Ltd., England, 1995.
2. O. Kafri and I. Glatt, "The Physics of Moire Metrology", John Wiley & Sons, Inc., New York, 1989.
3. D. Post, B. Han, and P. Ifju, "High Sensitivity Moire", Springer-Verlag, New York, 1994.
4. S.E. Yamada, "Mechanism for Board Warpage by Thermal Expansion of Surface Mounted Connector," IEEE Transaction on Components, Hybrids and Manufacturing Technology, Vol. 9, No. 4, pp. 508-512, December, 1986.
5. I.M. Daniel, T.M. Wang, and J.T. Gotro, "Thermomechanical Behavior of Multilayer Structures in Microelectronics", ASME Journal of Electronic Packaging, Vol. 112, pp. 11-15, March, 1990.
6. R.R.Tummala, E.J. Rymaszewski, and A.G. Klopfenstein, eds., "Microelectronics Packaging Handbook", Kluwer Academic Publishers, second edition, Norwell, MA, Chapter 7, pp. 62-71, 1999.
7. M. Stiteler and I.C. Ume, "System for Real-Time Measurements of Thermally Induced Warpage in a Simulated Infrared Soldering Environment", ASME Journal of Electronic Packaging, Vol. 119, pp. 1-7,1997.
8. Y.Y. Wang and P. Hassell, "On-Line Measurement of Thermally Induced Warpage of BGAs with High Sensitivity Shadow Moire," The International Journal of Microcircuits and Electronic Packaging, Vol. 21, No. 2, pp. 191-196, 1998.
9. D. Malacara, M. Servín, and Z. Malacara, "Interferogram Analysis for Optical Testing", Marcel Dekker, Inc., New York, Chapter 6, pp. 169-245,1998.