Measurement of dynamic warpage during thermal cycling of dielectric coated SS substrates for large area MCM-D packaging

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 2, 2000, Pages 77-85

  Dang, Anh X H ^a   Ume, I Charles ^a   Bhattacharya, Swapan K ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041779720     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.483138     Document Type: Article

References (9)

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2. Padmadinata, F. Z., Veerhoek, J. J., Van Dijk, G. J. A., and Huijsing, J. H., 1990, “Microelectronic Skin Electrode,” Sens. Actuators, Chemicals, B, B1, pp. 491-494.
3. Ishibashi, K., and Kimura, J., 1996, “New Anisotropic Conductive Film With Arrayed Conductive Particles,” IEEE Trans. Compon., Packag. Manuf. Tech-nol., Part B Adv. Packag., 19, No. 4, pp. 752-757.
4. Post, D., Han, B., and Ifju, P., 1994, High Sensitivity Moire, Springer-Verlag, New York.
5. Dang, A., Ume, C., and Bhattacharya, S., 1999, “A Study of the Warpage in Flexible SS Substrates for Large Area MCM-D Packaging,” Proceed., ASME, INTERPACK, Maui, Hawaii, pp. 1841-1847.
6. Wang, Y., and Hassel, P., 1998, “Measurement of a Thermally Induced Deformation of a BGA Using Phase-Stepping Shadow Moire,” Experimental/Numerical Mechanics in Electronic Packaging, 2, pp. 32-39.
7. Wang, Y., and Hassel, P., 1998, “On-Line Measurement of a Thermally Induced Warpage of a BGA With a High Sensitive Shadow Moire,” Int. J. Microcircuit Electron. Packag., 21, No. 2, 191-196.
8. Stitler, M. R., and Ume, I. C., 1997, “System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage,” ASME J. Electron. Packag., 119, pp. 1-7.
9. Stitler, M. R., Ume, I. C., and Leutz, B., 1996, “In Process Board Warpage Measurement in a Lab Scale Wave Soldering Over,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 19, pp. 562-569.