Impact of polymerization on warpage prediction of molded plastic packages

American Society of Mechanical Engineers, EEP

Volumn 16, Issue , 1996, Pages 127-131

  Teng, Sue Y ^a   Sarihan, Vijay ^a   Thomas, Ron ^a   Adhihetty, Indira ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; POLYMERIZATION; SHEET MOLDING COMPOUNDS; SHRINKAGE; THERMAL EXPANSION;

WARPAGE;

ELECTRONICS PACKAGING;

EID: 0030393277     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Review

References (4)