Cracking prediction of IC's passivation layer using J-integral

ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings

Volumn , Issue , 2003, Pages 362-367

  He, Y T ^a   Zhang, G Q ^a   Van Drie, W D ^b   Fan, X J ^a   Ernst, L J ^c  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b NXP SEMICONDUCTORS   (Netherlands)

^c DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Capacitive sensors; Electronics industry; Finite element methods; Inorganic materials; Integrated circuit reliability; Passivation; Semiconductor device reliability; Technological innovation; Tensile stress; Thermomechanical processes

Indexed keywords

CAPACITIVE SENSORS; CRACKS; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); PASSIVATION; SEMICONDUCTOR DEVICES; TENSILE STRESS;

INORGANIC MATERIALS; INTEGRATED CIRCUIT RELIABILITY; SEMICONDUCTOR DEVICE RELIABILITY; TECHNOLOGICAL INNOVATION; THERMOMECHANICAL PROCESS;

FINITE ELEMENT METHOD;

EID: 84946414067     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1298761     Document Type: Conference Paper

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