A suggestion for high power LED package based on LTCC

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1070-1075

  Park, Jung Kyu ^a   Shin, Hyun Dong ^b   Park, Young Sam ^a   Park, Sung Yeol ^a   Hong, Ki Pyo ^a   Kim, Byung Man ^a  

^a Samsung Electro Mechanics   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; HEAT RESISTANCE; HEAT SINKS; INTERFACES (MATERIALS); LIGHT EMITTING DIODES;

CERAMIC METAL INTERFACES; HEAT SINK SLUGS; HIGH POWER PACKAGES; MULTI LAYER CERAMIC METAL PACKAGES;

ELECTRONICS PACKAGING;

EID: 33845590018     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645786     Document Type: Conference Paper

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