Thermal management estimations for buried bump interconnection technology printed wiring boards with bump (filled via) interconnection

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 468-474

  Shimada, Osamu ^a   Hisano, Katsumi ^a   Iwasaki, Hideo ^a   Ishizuka, Masaru ^a   Fukuoka, Yoshitaka ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; CERAMIC MATERIALS; ELECTRIC WIRING; ELECTRONICS PACKAGING; HEAT RADIATION; HEAT RESISTANCE; PRINTED CIRCUIT DESIGN; SEMICONDUCTOR DEVICE MANUFACTURE; SUBSTRATES; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY; THERMODYNAMIC PROPERTIES;

PRINTED WIRING BOARDS; SILVER PASTE BUMPS; THERMAL MANAGEMENT ESTIMATIONS;

PRINTED CIRCUIT BOARDS;

EID: 0031620189     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)