Increasing the accuracy of structure function based evaluation of thermal transient measurements

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 85-90

  Rencz, M ^a   Poppe, A ^a   Kollar E ^b   Ress, S ^b   Szekely V ^b   Courtois, B ^c  

^a MicReD Ltd   (Hungary)

^b BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

^c TIMA LABORATORY   (France)

Author keywords

Interface thermal resistance measurement; Structure function evaluation; Thermal conductivity measurement; Thermal transient measurements

Indexed keywords

INTERFACE THERMAL RESISTANCE MEASUREMENT; STRUCTURE FUNCTION EVALUATION; THERMAL TRANSIENT MEASUREMENTS;

ERROR ANALYSIS; FUNCTIONS; HEAT RESISTANCE; MATHEMATICAL MODELS; NATURAL CONVECTION; PARAMETER ESTIMATION; THERMAL CONDUCTIVITY;

HEAT TRANSFER;

EID: 4444319831     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. V. Székely and Tran Van Bien: "Fine structure of heat flow path in semiconductor devices: a measurement and identification method", Solid-State Electronics, V.31, pp. 1363-1368 (1988)
2. M. Rencz, V. Székely, A. Morelli, C. Villa: "Determining partial thermal resistances with transient measurements and using the method to detect die attach discontinuities", SEMITHERM, March 1-14 2002, San Jose, CA, USA, Proceedings pp 15-20
3. M. Rencz, V. Székely: "Measuring partial thermal resistances in a heat flow path", IEEE Transactions On Components and Packaging Technologies, Vol 25, No 4, Dec. 2002, pp 547-553
4. V. Székely, M. Rencz, S. Török, S. Ress: "Calculating effective board thermal parameters from transient measurements", IEEE Transactions On Components and Packaging Technologies, Vol 24, No 4, Dec. 2001, pp 605-610.
5. V. Székely, M. Rencz: "Thermal Dynamics and the Time Constant Domain", IEEE Transactions On Components and Packaging Technologies, Vol.23, No.3, pp 687-594 (2000)
6. G.C. Temes, J.W. Lapatra: Circuit Synthesis and design, McGraw-Hill, 1977
7. http://www.micred.com/index1.htm
8. M. Rencz, E. Kollár, A. Poppe, S. Ress: "Evaluation Issues of Thermal Measurements Based on the Structure Functions", 9th THERMINIC Workshop, 24-26 September 2003, Aix-en-Provence, France, pp. 219-224
9. M. Rencz, A. Poppe, E. Kollár, S. Ress, V. Székely: "Increasing the accuracy of structure function based thermal material parameter measurements", Submitted to IEEE Transactions On Components and Packaging Technologies
10. th SEMITHERM Symposium, 2001, pp 120-125