Accelerated active high-temperature cycling test for power MOSFETs

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 1102-1110

  Schacht, R ^a   Wunderle, B ^a   Auerswald, E ^b   Michel, B ^a   Reichl, H ^b  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

Accelerated testing; High temperature electronics; Power cycling; Power MOSFETs; Reliability

Indexed keywords

COMPUTER SIMULATION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; HIGH TEMPERATURE TESTING; RELIABILITY THEORY;

ACCELERATED TESTING; HIGH TEMPERATURE ELECTRONICS; POWER CYCLING;

MOSFET DEVICES;

EID: 33845589658     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645468     Document Type: Conference Paper

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