Power cycling with high temperature swing of discrete components based on different technologies

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn 4, Issue , 2004, Pages 2593-2598

  Amro, R ^a   Lutz, J ^a   Lindemann, A ^b  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^b IXYS Semiconductor GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DISCRETE COMPONENTS; HIGH TEMPERATURE SWING; POWER CYCLING; POWER MODULES;

EXTRAPOLATION; MICROPROCESSOR CHIPS; POWER CONTROL; PROJECT MANAGEMENT; SEMICONDUCTOR JUNCTIONS; STATISTICAL METHODS; THERMAL EFFECTS;

ELECTRIC POWER SYSTEMS;

EID: 8744310706     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2004.1355239     Document Type: Conference Paper

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