Lifetime prediction and design of reliability tests for high-power devices in automotive applications

IEEE International Reliability Physics Symposium Proceedings

Volumn 2003-January, Issue , 2003, Pages 523-528

  Ciappa, Mauro ^a   Carbognani, Flavio ^a   Cova, Paolo ^b   Fichtner, Wolfgang ^a  

^a ETH ZURICH   (Switzerland)

^b UNIVERSITY OF PARMA   (Italy)

Author keywords

Automotive electronics; Hybrid vehicles; Lifetime prediction; Power devices

Indexed keywords

AUTOMOBILE ELECTRONIC EQUIPMENT; FATIGUE DAMAGE; FORECASTING; RELIABILITY; THERMAL CYCLING;

AUTOMOTIVE APPLICATIONS; COMPLIANT MATERIALS; FUNDAMENTAL EQUATIONS; HIGH-POWER DEVICES; LIFETIME PREDICTION; LIFETIME PREDICTION MODELS; POWER DEVICES; STATISTICAL DISTRIBUTION;

HYBRID VEHICLES;

EID: 33645589435     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2003.1197803     Document Type: Conference Paper

References (6)

1. M. Ciappa, W. Fichtner, Lifetime prediction of IGBT modules for traction applications, IEEE Int. Reliab. Physics Symp. 38 (2000)210-216
2. M. Ciappa, F. Carbognani, P. Cova, W. Fichtner, A Novel Thermomechanics-based Lifetime Prediction Model for Cycle Fatigue Failure Mechanisms in Power Semiconductors, Microelectronic Reliability 42 (2002)1653-1658
3. th Int. Symposium on Microelectronics IMAPS (2001), Baltimore, October 9-11, 2001
4. D. Rubesa, Lifetime prediction and constitutive modelling for creep-fatigue interaction, Borntraeger, Berlin 1991
5. C. Yun, P. Malberti, M. Ciappa, W. Fichtner, Thermal Component Model for Electrothermal Analysis of IGBT Module Systems, IEEE Trans. on Adv. Packaging 24 (2001)401-406
6. M. Ciappa, Some Reliability Aspects of IGBT Modules for High Power Applications, Hartung-Gorre Editor (2001) ISBN 3-89649-657-3