Impact of the die attach process on power & thermal cycling for a discrete style semiconductor package

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 221-226

  Liu, Yong ^a   Desbiens, Scott Irving Don ^a   Luk, Timwah ^a   How, N S ^b   Kwon, YongSuk ^b   Lee, SangDo ^b  

^a FAIRCHILD SEMICONDUCTOR   (United States)

^b Fairchild Semiconductor Suzhou Corp   (China)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SEMICONDUCTOR DEVICES; SOLDERING; STRESS ANALYSIS; THERMAL CYCLING;

DIE ATTACH PROCESS; POWER CYCLING; SEMICONDUCTOR PACKAGE; SOLDER MATERIAL;

ELECTRONICS PACKAGING;

EID: 33745698145     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502805     Document Type: Conference Paper

References (9)

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