Energy use in nanoscale manufacturing

IEEE International Symposium on Electronics and the Environment

Volumn 2006, Issue , 2006, Pages 266-271

  Zhang, Teresa W ^a   Boyd, Sarah ^a   Vijayaraghavan, Athulan ^a   Dornfeld, David ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY USE; NANOSCALE MANUFACTURING PROCESSES; PROCESS REQUIREMENTS;

ENERGY MANAGEMENT; PROCESS CONTROL; PRODUCTION ENGINEERING; SEMICONDUCTOR DEVICE MANUFACTURE;

NANOTECHNOLOGY;

EID: 33845583506     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEE.2006.1650074     Document Type: Conference Paper

References (19)

1. NNI, "What is nano," http://www.nano.gov/html/facts/whatIsNano. html, accessed Oct. 17, 2005, 2005.
2. S. Lloyd, L. B. Lave, and H. S. Matthews, "Life cycle benefits of using nanotechnology to stabilize platinum-group metal particles in automotive catalysts," Environmental Science & Technology, vol. 39, pp. 1384-1392, 2005.
3. S. Lloyd and L. Lave, "Life cycle economic and environmental implications of using nanocomposites in automobiles," Environmental Science & Technology, vol. 37, no. 15, pp. 3458-3466, 2003.
4. N. Taniguchi, "Future trends of nanotechnology," International Journal of the Japan Society for Precision Engineering, vol. 26, no. 1, pp. 1-7, March 1992.
5. A. Tseng and A. Notargiacomo, "Nanoscale fabrication by nonconventional approaches," Journal of Nanoscience and Nanotechnology, vol. 5, pp. 683-702, 2005.
6. Y. Chen and A. Pépin, "Nanofabrication: Conventional and nonconventional methods," Electrophoresis, vol. 22, pp. 187-207, 2001.
7. Y. Nishi and R. Doering, Eds., Handbook of Semiconductor Manufacturing Technology. Marcel Dekker, 2000.
8. N. Fang, H. Lee, C. Sun, and X. Zhang, "Sub-diffraction-limited optical imaging with a silver superlens," Science, vol. 308, pp. 534-537, April 2005.
9. SIA, "International technology roadmap for semiconductors," Semiconductor Industry Association, Tech. Rep., 2005.
10. S. Chou, "Nano-imprint lithography and lithographically induced self-assembly," Material Research Society (MRS) Bulletin, vol. 26, pp. 512-517, 2001.
11. H.-W. Li, B. V. O. Muir, G. Fichet, and W. T. S. Huck, "Nanocontact printing: A route to sub-50-nm-scale chemical and biological patterning," Langmuir, vol. 19, pp. 1963-1965, 2003.
12. M. Colburn, T. Bailey, B. Choi, J. Ekerdt, S. Sreenivasan, and C. Willson, "Development and advantages of step-and-flash lithography," Solid State Technology, vol. 44.7, pp. 67-78, 2001.
13. B. Bhushan, Ed., Handbook of Nanotechnology. Springer, 2004.
14. Y. Loo, R. W. Willett, K. Baldwin, and J. Rogers, "Additive, nanoscale patterning of metal films with a stamp and a surface chemistry mediated transfer process: Applications in plastic electronics," Applied Physics Letters, vol. 81, pp. 562-564, 2002.
15. J. Jo, J.-H. Jeong, K.-Y. Kim, E.-S. Lee, and C.-G. Choi, "Hybrid nanocontact printing (hncp) process technology," in Proceedings of The International Society for Optical Engineering (SPIE), 2005.
16. C. F. Murphy, G. Kenig, D. T. Allen, J. Laurent, and D. Dyer, "Development of parametric material, energy, and emission inventoriesfor wafer fabrication in the semiconductor industry," Environmental Science & Technology, vol. 37, no. 23, pp. 5373-5382, 2003.
17. E. Williams, R. Ayres, and M. Heller, "The 1.7 kilogram microchip: Energy and material use in the production of semiconductor devices," Environmental Science & Technology, vol. 36, pp. 5504-5510, 2002.
18. E. Williams, "Energy intensity of computer manufacturing: Hybrid assessment combining process and economic input-output methods," Environmental Science & Technology, vol. 38, pp. 6166-6174, 2004.
19. N. Krishnan, S. Raoux, and D. Domfeld, "Quantifying the environmental footprint of semiconductor equipment using the environmental value systems analysis (env-s)," IEEE Transactions on Semiconductor Manufacturing, vol. 17, pp. 554-561, 2004.