Micromachined vibration isolation filters to enhance packaging for mechanically harsh environments

Journal of Microelectronics and Electronic Packaging

Volumn 2, Issue 4, 2005, Pages 223-231

  Dean, Robert ^a   Flowers, George ^a   Sanders, Nicole ^a   Horvath, Roland ^b   Kranz, Michael ^b   Whitley, Michael ^b  

^a AUBURN UNIVERSITY   (United States)

^b Stanley Associates Inc   (United States)

Author keywords

Filter; MEMS; Packaging; Vibration

Indexed keywords

ELECTRONICS PACKAGING; GYROSCOPES; MICROELECTROMECHANICAL DEVICES; MICROOPTICS; OSCILLATORS (ELECTRONIC); VIBRATIONS (MECHANICAL);

COMPONENT FAILURE; FLUIDIC DAMPING; INDUSTRIAL MACHINERY; MICROMACHINED VIBRATION;

WAVE FILTERS;

EID: 33845580231     PISSN: None     EISSN: None     Source Type: Journal    
DOI: 10.4071/1551-4897-2.4.223     Document Type: Article

References (13)

1. D. S. Steinberg, "Vibration analysis for electronic equipment", John Wiley & Sons, Inc., New York, 2000, pp. 10-16.
2. R. Dean, G. Flowers, S. Model, K. MacAllister, R. Horvath, A. Matras, G. Robertson, R. Glover, "Vibration isolation of MEMS sensors for aerospace applications", IMAPS International Conference and Exhibition on Advanced Packaging and Systems, Reno, NV, March 10-13, 2002, Proceedings pp. 166-170.
3. V. T. Srikar and S. D. Senturia, "The reliability of micromechanical Systems (MEMS) in shock environment", J. of Microelectromechanical Systems, Vol. 11, Issue 3, June 2002, pp. 206-214.
4. J.R. Reid, V. M. Bright and J. A. Korinski, "A micromachined vibration isolation system for reducing the vibration sensitivity of surface transverse wave resonators", IEEE. Tran. Ultrasonics, Ferro. And Freq. Cntrl., Vol. 45 No. 2, 3/98, pp. 528-534.
5. J.R. Reid, V. M. Bright, J. T. Stewart and J. A. Kosinski, "reducing the normal acceleration sensitivity of STW resonators using micromachined isolation systems", 1996 IEEE International Frequency Control Symposium.
6. L. Meirovitch, "Elements of vibration analysis", McGraw-Hill Book Company, New York, 1986, pp. 63-67.01
7. C. R. Fuller, S. J. Elliot and P. A. Nelson, "Active control of vibration", Academic Press, Harcourt Brace & Company, New York, 1996, pp. 115-152.
8. M. Kranz, T. Hudson, P. Ashley, P. Ruffin, S. Burgett, M. Temmen, and J. Tuck, "A single layer silicon-on-insulator MEMS gyroscope For wide dynamic range and harsh environment applications", Transducers '03, Boston, MA, June 9th, 2003.
9. Tai-Ran Hsu, "MEMS & microsystems design and manufacture", McGraw-Hill, Boston, MA, 2002, pp. 120-126.
10. S. Pourkamali, A. Hashimura, R. Abdolvand, G. K. Ho, A. Erbil, and F. Avazi, "High-Q single crystal silicon HARPSS capacitive beam resonators with self-aligned sub-100-nm transduction gaps", J. Microelectromechanical Systems, Vol. 12, NO. 4, August 2003, pp. 487-496.
11. M. S.-C. Lu and G. K. Fedder, "Position control of parallel-plate microactuators for probe-based data storage", J. Microelectromechanical Systems, Vol. 13, No. 5, October 2004, pp. 759-769.
12. Y. Liu, T. P. Waters, M. J. Brennan, "A comparison of semi-active damping control strategies for vibration isolation of harmonic disturbances", J. of Sound and Vibration, Vol. 280, 2005, pp. 21-39.
13. C. B. O'Neal, A. P. Malshe, S. B. Singh, W. D. Brown, and W. P. Eaton, "Challenges in the packaging of MEMS", 1999 IEEE International Symposium on Advanced Packaging Materials, March 14-17, 1999.