Development of high-K embedded capacitors on printed wiring board using sol-gel and foil-transfer processes

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 514-520

  Abothu, Isaac Robin ^a   Raj, P Markondeya ^a   Balaraman, Devarajan ^a   Govind, Vinu ^a   Bhattacharya, Swapan ^a   Sacks, Michael D ^b   Swaminathan, M ^a   Lance, Michael J ^c   Tummala, Rao R ^a  

^a Packaging Research Center   (United States)

^b Georgia Institute of Technology   (United States)

^c OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EMBEDDED CAPACITORS; FOIL-TRANSFER PROCESSES; HIGH DIELECTRIC CONTACT; SOL-GEL DEPOSITION;

BARIUM COMPOUNDS; CAPACITORS; COSTS; ELECTRIC WIRING; EMBEDDED SYSTEMS; METAL FOIL; OXIDATION; POTASSIUM; SOL-GELS; STRONTIUM COMPOUNDS; X RAY DIFFRACTION;

PRINTED CIRCUIT BOARDS;

EID: 10644233912     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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