Electroless Ni-P/Ni-W-P thin-film resistors for MCM-L based technologies

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 232-239

  Chahal, P ^a   Tummala, R R ^a   Allen, M G ^a   White, G E ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b MOTOROLA INC   (United States)

Author keywords

electroless; embedded; Integrated; Ni P; Ni W P; PWB substrate; resistor

Indexed keywords

ELECTROLESS PLATING; NICKEL ALLOYS; PHOTORESISTS; RESISTORS; SCATTERING PARAMETERS; SURFACE TREATMENT; TEMPERATURE; DEPOSITION; DISSOLUTION; ELECTRIC CONDUCTIVITY OF SOLIDS; HEAT RESISTANCE; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE STRUCTURES; SUBSTRATES; THIN FILM DEVICES;

ELECTRICAL AND MECHANICAL PROPERTIES; ELECTROLESS; EMBEDDED; INTEGRATED; LARGE-AREA SUBSTRATES; PATTERNED PHOTORESISTS; POWER-HANDLING CAPABILITY; TEMPERATURE COEFFICIENT OF RESISTIVITY;

SUBSTRATES; MULTICHIP MODULES;

LAMINATED MULTICHIP MODULES (MCML); TEMPERATURE COEFFICIENT OF RESISTIVITY (TCR);

EID: 0031636603     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678699     Document Type: Conference Paper

References (18)

1. R. R. Tummala, EJ. Rymaszweski and A. Klopfenstein, Microelectronics Packaging Handbook, 2nd edition, Chapman-Hall (New York, 1997).
2. J. Rector, J. Dougherty, V. Brown, J. Galvagni and J. Prymak, "Integrated and Integral Passive Components: A Technology Roadmap", in Proc. of 47th Elect. Comp., Tech. Conf, San Jose, CA, USA, 1997, pp. 713-723.
3. D. Scheid, "Advanced MCM-D with Embedded Resistors", in MCM, 1994, pp. 273-278.
4. Handbook of Thin Film Technology, ed. L. I. Maissel and R. Glang, McGraw-Hill Book Company, NY, 1983.
5. Shah, A. V., et al., "A Review of AT&T's POLYTHIC Multichip Module Technology, " Proc. National Electronic packaging and Production Conference, 1991, pp. 537-539.
6. H. Yoshino, T. Ihara, S. Yamanaka, T. Igarashi, " Tantalum oxide thin-film capacitor suitable for being incorporated into an integrated circuit package, " in Sixth IEEE CHMT Int. Electron Manuf. Techn. Symp., 1989, pp. 156-159.
7. T. Lenihan, L. Schaper, Y. Shi, G. Morcan and K. Fairchild, "Embedded Thin Film Resistors, Capacitors, Inductors in Flexible Polyimide Films", in Proc. of 46th Elect. Comp., Tech. Conf, Fl, USA, 1996, pp. 192-202.
8. Loj o. vasuucvan anu J. anaiKn, onrinKage maxcnea cofireable thick film resistors for LTCC", in Proc Electron Comp. Tech. Conf., Piscataway, NJ, USA, 1994, pp. 612-616.
9. J. Lernout, A. V. Calster, "On the Effective Integration of Resistors and Capacitors into a MCM-Si Design", in ICEMCM'96 Proceedings, pp. 391-396.
10. H. Kanda, R. C. Mason, C. Okabe, J. D. Smith, R. Velasquez, "Buried Resistors and Capacitors for Multilayer Hybrids", ISHM '95 Proceeding, pp. 47-52.
11. W. Li and R. R. Tummala, "P4 Process-A Novel Multilayer High-Density Thin-Film Buildup Technology on PWB", in Proc. of 48th Elect. Comp., Tech. Conf, Seattle, WA, USA, 1998, this proceeding.
12. Technical Bulletin, Processing Resistor/Conductor Material, Ohmega Technologies, April, 1996.
13. S. Yamada, T. Tsuruoka, H. Nakagawa, T. Kanamori, S. Shibata, "Electroless Ni-P Resistors for Fusing Roll", IEEE Transactions on Components, Hybrids, Manufacturing Tech., Vol. 13, No. 3, 1990, pp. 576-578.
14. Lltj ivi. remauuez, J. manmcz-. L»uari, aim J./A. iucna, "Electrical Properties of Electroless Ni-P Thin Films", Electrochemica Acta, Vol. 31, No. 1, pp. 55-57, 1986.
15. I. Koiwa, M. Usada, T. Osaka, "Effect of Heat-Treatement on the Structure and Resistivity of Electroless Ni-W-P Alloy Films", J. Electrochem. Soc, Vol. 137, No. 11, pp. 1222-12228, Nov. 1990.
16. H. Aoki, "Study of Mass Production of Low Ohm Metal Film Resistors Prepared by Electroless Plating", IEICE Transactions, Vol. E. 74, No. 7, pp. 2049-2054, July 1991.
17. H. Sawai, T. Kanamori, I. Koiwa, S. Shibata, K. Nihei, "A Study on the Low Energy Consuption Thermal Head Using Electroless Ni-W-P Alloy Films as Heating Resistors", J. Electrochem. Soc, Vol. 137, No. 11, pp. 3653-3659, Nov. 1990.
18. Wolfgang Riedel, "Electroless Nickel Plating", ASM International Finishing Publications LTD, 1991.