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Volumn 2, Issue , 2004, Pages 1693-1697
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System-on-a-Package (SOP) module development for a digital, RF and optical mixed signal integrated system
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Author keywords
[No Author keywords available]
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Indexed keywords
DATA REDUCTION;
LOW TEMPERATURE EFFECTS;
MESFET DEVICES;
MODULATION;
OPTICAL WAVEGUIDES;
SIGNAL GENERATORS;
SIGNAL INTERFERENCE;
THERMAL EXPANSION;
INTELLIGENT NETWORK COMMUNICATOR (INC);
MIXED SIGNALS;
SIGNAL INTEGRATED SYSTEM;
SYSTEM-ON-A-PACKAGE (SOP);
SIGNAL PROCESSING;
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EID: 10444236437
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (3)
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References (4)
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