Fabrication of application specific integrated passive devices using wafer level packaging technologies

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1594-1601

  Zoschke, Kai ^a   Wolf, Jürgen ^a   Töpper, Michael ^a   Ehrmann, Oswin ^a   Fritzsch, Thomas ^a   Scherpinski, Katrin ^a   Reichl, Herbert ^a   Schmückle, Franz Josef ^b  

^a FRAUNHOFER IZM   (Germany)

^b LEIBNIZ INSTITUT FÜR HÖCHSTFREQUENZTECHNIK   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; ELECTRONICS PACKAGING; STANDARDS; SYNTHESIS (CHEMICAL); SYSTEMS ANALYSIS; WSI CIRCUITS;

INTEGRATED PASSIVES; PASSIVE DEVICES; THIN FILM FABRICATION;

APPLICATION SPECIFIC INTEGRATED CIRCUITS;

EID: 24644519094     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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