The next wafer diameter change

Semiconductor International

Volumn 27, Issue 6, 2004, Pages 87-94

  Hammond, Martin L ^a  

^a TMX International   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SIZE; EQUIPMENT DESIGN; MARKET PENETRATION; WAFER DIAMETER;

BATCH DATA PROCESSING; DECISION MAKING; FORECASTING; INVESTMENTS; PLANNING; STANDARDIZATION; WSI CIRCUITS;

SILICON WAFERS;

EID: 18144395412     PISSN: 01633767     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (11)

1. International Technology Roadmap for Semiconductors (ITRS), 2001 Edition, Front End Processes and Lithography, http://public.itrs. net/Files/2001 ITRS/Home.htm
2. ITRS 2003 Edition, http://public.itrs.net/Files/20031TRS/Home.htm.
3. P.A. Gargini and R.R. Doering, "2003 ITRS Highlights" (and other related papers in this volume), Solid State Technology, January 2004, p. 72.
4. M. LaPedus, "ITRS Roadmap Must Become More Realistic, Says Applied CEO," Silicon Strategies, Oct. 2, 2003, www.siliconstrategies.com/article/ showArticle.jhtml?articleID=15201136.
5. SEMI seminar "Fundamentals of Product Marketing," session "The Product Marketing Environment," produced and presented by The Quest Team (www.quesrteam.com) and SEMI (www.semi.org).
6. D. Vogler, "Evolving Business Strategies Are Key to Upbeat 300mm Outlook," Solid State Technology, October 2002, p. 27.
7. D.J. Rose, "Future Silicon Trends," Emcon, Rose Associates, Sept. 13-15, 1999.
8. M. Hammond, "Silicon Epitaxy, a 1983 Perspective," Semiconductor international, October 1983, p. 58.
9. M.L. Hammond, private data on wafer diameter history for 1960s and 1970s.
10. S.W. Jones, "300 mm Perceptions and Realities," Semiconductor International, October 2003, p. 69.
11. M.L. Hammond, "Moore's Law: The First 70 Years," Semiconductor International, April 2004, p. 51.