SCOPUS 정보 검색 플랫폼

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 43-46

Surface finish effects on high-speed interconnects

(4) Wu, Xin a Ramahi, Omar M a Brist, Gary A b Cullen, Donald P c

a UNIVERSITY OF MARYLAND (United States)

b INTEL CORPORATION (United States)

c MacDermid Incorporated (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIELECTRIC PROPERTIES; ELECTROMAGNETIC WAVE INTERFERENCE; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MICROSTRIP LINES; NETWORKS (CIRCUITS); OPTICAL INTERCONNECTS; SKIN EFFECT; SOLDERED JOINTS; SUBSTRATES; ELECTRIC CONVERTERS; FINISHING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SOLDERING;

HIGH FREQUENCY STRUCTURE SIMULATORS (HFSS); TIME DOMAIN REFLECTOMETRY (TDR); COUPLED MICROSTRIP LINES; DIFFERENTIAL MODE; FREQUENCY DEPENDENT; FULL-WAVE SIMULATIONS; GIGAHERTZ RANGE; HIGH SPEED INTERCONNECT; HIGH-SPEED INTERCONNECTS; HOT-AIR SOLDER LEVELING; MATERIAL COMPATIBILITY; MATERIAL COMPOSITIONS; MICROSTRIP LINE STRUCTURE; OPERATING FREQUENCY; SIGNAL DEGRADATION; SIGNAL INTEGRITY; SIGNAL LOSS; SURFACE FINISHES;

PRINTED CIRCUIT BOARDS; SURFACES;

EID: 1242309829 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1115/ipack2003-35332 Document Type: Conference Paper

Times cited : (3)

References (9)

1
- 0032644309
- HASL Alternatives
- D. Cullen, 1999, "HASL Alternatives," PC Fabrication.
- (1999) PC Fabrication
- Cullen, D.¹

2
- 84862055967
- Alternatives to HASL: Users Guide for Surface Finishes
- D. T. Parquet, D. W. Boggs, "Alternatives to HASL: Users Guide for Surface Finishes," Merix papers and presentations, www.merix.com
- Merix Papers and Presentations
- Parquet, D.T.¹ Boggs, D.W.²

3
- 1242306617
- IPC Technology Marketing Research Council, 2002, Chicago, IL
- IPC Technology Marketing Research Council, 2002, Chicago, IL.

4
- 1242284283
- Degradation of High-Frequency Signal through Traces Plated with Alternative Finishes and Lead-free Solder
- College Park, MD
- X. Wu, M. H. Kermani, L. Li, O. M. Ramahi, 2002, "Degradation of High-Frequency Signal through Traces Plated with Alternative Finishes and Lead-free Solder", CALCE EPSC Technical Review and Planning Meeting, College Park, MD.
- (2002) CALCE EPSC Technical Review and Planning Meeting
- Wu, X.¹ Kermani, M.H.² Li, L.³ Ramahi, O.M.⁴

5
- 40549109242
- Effects of Surface Finish on High Frequency Signal Loss Using Various Substrate Materials
- Anaheim, CA
- D. Cullen, B. Kline, G. Moderhock, L. Gatewood, 2001, "Effects of Surface Finish on High Frequency Signal Loss Using Various Substrate Materials," IPC Printed Circuits EXPO® 2001, Anaheim, CA.
- (2001) IPC Printed Circuits EXPO® 2001
- Cullen, D.¹ Kline, B.² Moderhock, G.³ Gatewood, L.⁴

6
- 1642279751
- Reduction of High-frequency Signal Loss through The Control of Conductor Geometry And Surface Metalization
- Chicago, IL
- G. Brist, D. Cullen, D. Luttrull, J. Martin, 2002, "Reduction of High-frequency Signal Loss through The Control of Conductor Geometry And Surface Metalization," SMTA International 2002, Chicago, IL.
- (2002) SMTA International 2002
- Brist, G.¹ Cullen, D.² Luttrull, D.³ Martin, J.⁴

7
- 0003410795
- Wiley, New York
- J. Jin, 2002, The Finite Element Methods in Electromagnetics, Second Edition, Wiley, New York.
- (2002) The Finite Element Methods in Electromagnetics, Second Edition
- Jin, J.¹

8
- 0003989985
- John Wiley & Sons, New York
- Clayton R. Paul, 1992, Introduction to Electromagnetic Compatibility, John Wiley & Sons, New York.
- (1992) Introduction to Electromagnetic Compatibility
- Paul, C.R.¹

9
- 0004088245
- IEEE Press, New York
- R. E. Collin, 2001, Foundations for Microwave Engineering, Second Edition, IEEE Press, New York.
- (2001) Foundations for Microwave Engineering, Second Edition
- Collin, R.E.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.